In a market where new products will sell only if they are the best of the previous numbers level, data sheet, benchmarks and performance, it becomes increasingly important to be able to contain the heat of top range processors which, in addition to having a very high core count, they also have higher clocked at 2 GHz, all in tiny size and especially inside shells decidedly disinclined to get cold very quickly. In addition there are software that allow you to make more and more operations simultaneously and even transform into PC.
The Lumia 950XL was one of the first smartphones to integrate a passive cooling system using internal fluid passing from one point to another device through a coil. A solution is not unique but still little used.
If the S810 has certainly done talked about for the high operating temperatures, it seems that using similar solutions to that you see above, will be increasingly used in the top range in the future. Although the Snapdragon 820 has on paper an optimization greater than the heat, Samsung is reportedly still making a passive cooling system.
Being able to quickly disperse the heat is difficult in every product and working several fronts simultaneously (production process optimization software and hardware solutions) helps to achieve better energy efficiency. Galaxy S7 seems a candidate to take advantage of this cooling system and confirmation comes a “supposed” engineer who through percomputer explained how heat compensation is a real art, difficult to master and control.
Samsung Galaxy S7 is available online from ePRICE to 555 euros. The value for money isdiscreet and is one of the best devices in this price range.